合金化Ti对浸金属碳/铜复合材料热导率的影响
Effects of Alloying Ti on Thermal Conductivity of C / Cu Ｃomposite Prepared by Pressureless Infiltration
高 媛, 胡 锐, 李金山, 寇宏超
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作者单位：西北工业大学 材料学院, 陕西 西安 710072
中文关键字：碳纤维细编穿刺织物； Cu基复合材料； 无压浸渗； 热导率
英文关键字：fine weave pierced fabrics of carbon fiber; copper matrix composite; pressureless infiltration; thermal conductivity
中文摘要：在基体中添加少量活性Ti，采用无压浸渗工艺制备碳纤维细编穿刺织物/铜复合材料(C/Cu)，并利用XRD、SEM和EDS等检测手段对复合材料的微观组织和界面特性进行研究，并对复合材料的热导率进行测定。结果表明，在铜基体中加入有助于强碳化物形成的Ti，可有效提高铜及铜合金与碳的自发润湿性，实现了采用无压浸渗工艺制备C/Cu复合材料；随温度的升高复合材料热导率增加；当Ti含量在3%～5%时，复合材料热导率随Ti含量的增加而增大；当Ti含量超过5%时，复合材料热导率随Ti含量的增加而降低，说明Ti含量对复合材料热导率有显著影响。
英文摘要：C/Cu composite reinforced by fine weave pierced fabrics of carbon fiber was successfully synthesized by pressureless infiltration in the presence of adding Ti into copper matrix. The microstructure and interface characteristics of the composite were analyzed by XRD, SEM and EDS. Meanwhile, the thermal conductivity of the samples were tested. The results show that the wettability of copper matrix with carbon fiber could be obviously improved due to the addition of Ti. The composite prepared by pressureless infiltration becomes available. The thermal conductivity of the composite increases with the increase of temperature when the content of Ti is from 3% to 5%, but it rapidly decreases with the content of Ti above 5%.