等通道转角挤压工艺制备块体超细晶纯铜的研究
Preparation of Ultra-fine Grain Pure Copper by Equal Channel Angular Pressing
田 华， 邓云伟， 崔元萍
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作者单位：(中国工程物理研究院 核物理与化学研究所， 四川 绵阳 621900)
中文关键字：等通道转角挤压； 纯铜； 超细晶
英文关键字：equal channel angular pressing (ECAP); pure copper; ultra-fine grain
中文摘要：利用等通道转角挤压(Equal Channel Angular Pressing，简称ECAP)工艺制备超细晶块体纯铜，并研究了其微观组织和硬度的变化。结果表明：纯铜塑性优良，在室温下能够顺利进行ECAP挤压，累积塑性变形量大于100%；经过两道次C形路线挤压可将纯铜晶粒细化至10 μm以下，达到超细晶，同时硬度提高4倍以上：ECAP工艺制备的超细晶纯铜可用于制作较高强度的连接受力部件。
英文摘要：The ultra-fine grain pure copper was prepared by equal channel angular pressing (ECAP), the microstructure and hardness were studied. The results show that pure copper can be smoothly pressed at room temperature because of its good plasticity. The total deformation can be higher than 100%. After pressed twice at route C shape, the grain size of pure copper can be lower than 10 μm, and the hardness is 4 times higher than pure copper. The ultra-fine grain pure copper prepared by ECAP can be used as stress components.