SnAgCuRE系无铅焊点形态模型的数学分析及试验研究
Mathematical Analysis and Experimental Research of Shape Model for SnAgCuRE Lead-free Solder Joints
杨 洁1， 冯晓乐2，郝秀云1，王玉鹏1
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作者单位：（1.南京信息职业技术学院 机电学院,江苏 南京 210046;2.江苏经贸职业技术学院 工程技术系,江苏 南京 210007）
中文关键字： SnAgCuRE;焊点形态;数学模型
英文关键字：SnAgCuRE; the shape of solder joints; mathematical model
中文摘要： 根据表面组装RC3216元件焊点的结构特征,采用数学分析方法建立了焊点形态的数学模型,预测了片式元件的SnAgCuRE系无铅钎料焊点形态,并对预测的焊点形态进行了试验验证。结果是预测结果与试验结果吻合很好,最大相对误差仅为7%。
英文摘要：According to the frame of soldered joints of the surface mount RC3216, the shape mathematic model of solder joints is established by applying the math analysis method. The shape of SnAgCuRE solder joints on the chip component was forecasted, and the relevant experiment was also carried out. The predicting results are in good agreement with the test results, and the maximum relative error is only 7%.