微量RE对SnAgCu无铅钎料力学性能和润湿性能的影响
Effect of Rare Earth Elements on Mechanical Property and Wettability of SnAgCu Solder Alloy
杨 洁1, 冯晓乐2, 程光辉3
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作者单位:1.南京信息职业技术学院 机电学院, 江苏 南京 210046; 2.江苏经贸职业技术学院 工程技术系, 江苏 南京 210007; 3.济源职业技术学院, 河南 济源 454650)
中文关键字:SnAgCu钎料; 稀土; 力学性能; 润湿性能
英文关键字:SnAgCu solder; rare earth; mechanical property; wettability
中文摘要:利用光学显微镜、扫描电镜和能谱分析仪等检测手段,研究了微量RE对低银Sn2.5Ag0.7Cu无铅钎料的力学性能和润湿性能影响。结果表明,添加微量RE可以提高该钎料的力学性能,改善润湿性能。当RE添加量为0.1wt%时,钎料的伸长率和拉伸强度最大,此时,该钎料在Cu焊盘上的铺展面积也最大。但过量的RE会导致性能的下降。这些性能的改变与微量RE对其显微组织的影响有关。
英文摘要:The effect of rare earth elements on the mechanical properties and wettability of Sn2.5Ag0.7Cu solder were investigated by optical microscopy, SEM and EDS. The results indicate that the addition of trace RE can improve the properties of SnAgCu lead-free solder. The elongation and tensile strength and spreading area on Cu can reach the optimal values, when RE addition is 0.1wt%. But excessive RE can lead to the decline of performance. The property changes of Sn2.5Ag0.7Cu solder are attributed to the change of the microstructure caused by trace rare earths additions.