Abstract: The complete process of selective metallization on the surface of complex ceramic structure formed by light curing was proposed.Taking advantage of light curing in the field of manufacturing complex ceramic structure, and then, the active metal layer was left on the surface of ceramic with metal engraving, finally, combined with the chemical copper plating process, the controllable directional metallization of three-dimensional structure, internal surface and complex ceramic surface can be realized at room temperature.The results show that the copper coating manufactured by this method has the characteristics of high precision and small roughness, and has excellent bonding force and good weldability.The resistivity of the copper layer measured by using a four-probe resistance meter is about 1.03 mΩ·cm.Finally, antenna and other structures based on alumina ceramic is manufactured by this process.The examples show that the method of light curing and surface metallization can realize the rapid manufacturing of complex ceramic microwave devices, and provide new design and manufacturing ideas for microwave devices meeting the special application scenarios on aeronautics and astronautics.