复合板压力容器贴板修复工艺鼓包问题的有限元仿真分析

    Finite Element Simulation Analysis on Bulging Defect in Repair Process of Composite Plate Pressure Vessels

    • 摘要: 压力容器贴板修复工艺利用耐蚀合金管材衬里进行防腐改性,可有效解决高腐蚀性气田地面管道的腐蚀问题。然而,压力容器贴板修复后内衬板的焊接失效和鼓包等问题影响了该工艺在油气储运行业的应用。围绕复合板压力容器贴板修复工艺的鼓包问题,通过ANSYS有限元仿真的方法,建立了内衬板不同初始鼓包高度和焊点直径下的焊点等效分析模型,对内衬板受压变形过程中不同鼓包高度、不同焊点直径对焊点受力的影响规律进行了系统分析。结果表明,当对内衬板施加11.5 MPa压强时,随着鼓包高度的增加(1~5 mm),鼓包中心焊点平均拉应力以及与中心焊点距离最近的焊点剪切应力逐渐增加,中心焊点失效形式为拉脱,与中心焊点距离最近的焊点失效形式为剪切失效,并且与中心焊点距离最近的焊点失效风险更大。随着焊点直径的增加(8~12 mm),与中心焊点距离最近的焊点结合面处平均剪应力逐渐降低,说明增加焊点直径可降低焊点失效风险。

       

      Abstract: The repair process of pressure vessel composite plate involves the use of corrosion-resistant alloy pipe lining to effectively solve the corrosion issues in highly corrosive gas field pipelines. However, the welding failure and bulging of the lining plate after the repair process affect its application in the oil and gas transportation industry. For the bulging issues in the repair process of composite plate pressure vessels, an equivalent analysis model of solder joints under different initial bulging heights and solder joint diameters was established using ANSYS finite element simulation. The influence of different bulging heights and solder joint diameters on the stress of solder joints during the compression process of the lining plate was systematically analyzed. The results show that when the lining plate is subjected to a pressure of 11.5 MPa, with the increase of bulging height from 1 mm to 5 mm, the average tensile stress of the center weld point and the shear stress of the solder joint nearest to the center solder joint gradually increase. The failure mode of the center weld point is pull-off, while the failure mode of the solder joints closest to the center solder joint is shear failure, and the failure risk is higher for the solder joints closest to the center solder joint. With the increase of solder joint diameter from 8 mm to 12 mm, the shear stress of the solder joints closest to the center solder joint also decreases, indicating that increasing the solder joint diameter can reduce the failure risk of solder joint.

       

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