Effect of Intermediate Annealing on Interfacial Bonding Properties of Cu/Al Clad Plate

Cu/Al clad plate was prepared by intermediate annealing and non-intermediate annealing in two-pass rolling process, and the effect of intermediate annealing treatment on interface bonding properties of the clad plate was studied. The results show that the interfaces of Cu/Al clad plate prepared under the two processing conditions are firmly bonded, but the intermediate annealing process is more conducive to improving the bonding strength of the rolled Cu/Al clad plate. The peeling strength of the clad plate after two passes of rolling without intermediate annealing is 28.29 MPa, while the peeling strength of the clad plate after intermediate annealing is 34.05 MPa.This is because the interface of the clad plate prepared by two passes of rolling after intermediate annealing treatment is composed of metallurgical bonding zone and physical bonding zone, which synergistically strengthens the bonding properties of the interface.